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** Chemical bonding
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** Vietnam War: Students at the University of Wisconsin-Madison protest over recruitment by Dow Chemical on the University campus.
** and bonding
** Chip bonding, method of wiring some chips ( also from different manufactures ) together on die an integrated circuit
** Wire bonding, a method of making interconnections between a microchip and the outside world as part of semiconductor device fabrication
** Particle aggregation, direct mutual attraction between particles ( atoms or molecules ) via van der Waals forces or chemical bonding
** One prominent example of a wafer bonding process is the Smart Cut method developed by the French firm Soitec which uses ion implantation followed by controlled exfoliation to determine the thickness of the uppermost silicon layer.
Chemical and bonding
The term " covalence " in regard to bonding was first used in 1919 by Irving Langmuir in a Journal of the American Chemical Society article entitled " The Arrangement of Electrons in Atoms and Molecules ".
Chemical bonding and reactivity in organometallic compounds is often discussed from the perspective of the isolobal principle.
Chemical bonding features such as stereochemistry, hydrogen bonding and distribution of bond lengths and angles are complementary measures of the model quality.
* Chemical polarity, a concept in chemistry which describes how equally bonding electrons are shared between atoms
Chemical bonding is likely to change under high pressure, when the P * V term in the free energy becomes comparable to the energies of typical chemical bonds-i. e.
Electron density calculated for aniline, high density values indicate atom positions, intermediate density values emphaisize Chemical bond | bonding, low values provide information on a molecule's shape and size.
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