Research in condensed matter physics has given rise to several device applications, such as the development of the semiconductor transistor, and laser technology.

This can continue to the point of complete breakdown of normal resistance at a semiconductor junction, and failure of the device ( this may be temporary or permanent depending on whether there is physical damage to the crystal ).

This troublesome device was superseded by thermionic diodes by the 1920s, but after high purity semiconductor materials became available, the crystal detector returned to dominant use with the advent of inexpensive fixed-germanium diodes in the 1950s.

In a p-channel depletion-mode device, a positive voltage from gate to body creates a depletion layer by forcing the positively charged holes away from the gate-insulator / semiconductor interface, leaving exposed a carrier-free region of immobile, negatively charged acceptor ions.

This X < sub > L </ sub > is used in complement with an active semiconductor device to maintain very accurate voltage control.

ICs were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication.

Early developments of the integrated circuit go back to 1949, when the German engineer Werner Jacobi ( Siemens AG ) filed a patent for an integrated-circuit-like semiconductor amplifying device showing five transistors on a common substrate in a 2-stage amplifier arrangement.

In his patent application of 6 February 1959, Kilby described his new device as “ a body of semiconductor material ... wherein all the components of the electronic circuit are completely integrated .” The first customer for the new invention was the US Air Force.

Ion implantation is used in semiconductor device fabrication and in metal finishing, as well as various applications in materials science research.

MEMS became practical once they could be fabricated using modified semiconductor device fabrication technologies, normally used to make electronics.

The fabrication of MEMS evolved from the process technology in semiconductor device fabrication, i. e. the basic techniques are deposition of material layers, patterning by photolithography and etching to produce the required shapes.

Digital cameras use photosensitive electronics, either charge-coupled device ( CCD ) or complementary metal – oxide – semiconductor ( CMOS ) image sensors, consisting of a large number of single sensor elements, each of which records a measured intensity level.

Solid-state relays control power circuits with no moving parts, instead using a semiconductor device to perform switching.

Typical concentration values fall somewhere in this range and are tailored to produce the desired properties in the device that the semiconductor is intended for.

This type of data is considered to be electronically encoded data, whether or not it is electronically stored in a semiconductor device, for it is certain that a semiconductor device was used to record it on its medium.

A transistor is a semiconductor device used to amplify and switch electronic signals and electrical power.

Since the production of high-quality semiconductor materials was still decades away, Lilienfeld's solid-state amplifier ideas would not have found practical use in the 1920s and 1930s, even if such a device were built.

Its importance in today's society rests on its ability to be mass produced using a highly automated process ( semiconductor device fabrication ) that achieves astonishingly low per-transistor costs.

The MOSFET, an IC, is the most used semiconductor device today.

Silicon used in semiconductor device manufacturing is currently fabricated into boules that are large enough in diameter to allow the production of 300 mm ( 12 in.

Some semiconductor fabrication processes use its oxide for integrated circuits at 45 nm and smaller feature lengths.

In the ion implantation semiconductor fabrication process of wafers, it is important for the workers to minimize their exposure to the toxic materials are

For this reason, the semiconductor fabrication facilities are highly automated, and may feature negative pressure gas bottles safe delivery system ( SDS ).

Although this appears a challenging problem given current resources, many tools will be available to help future researchers: Moore's Law predicts further increases in computer power, semiconductor fabrication techniques continue to approach the nanoscale, and researchers grow ever more skilled at using proteins, ribosomes and DNA to perform novel chemistry.

MOS Technology, Inc., also known as CSG ( Commodore Semiconductor Group ), was a semiconductor design and fabrication company based in Norristown, Pennsylvania, in the United States.

In semiconductor fabrication, dry etching techniques are generally used, as they can be made anisotropic, in order to avoid significant undercutting of the photoresist pattern.

The workers in a semiconductor fabrication facility are required to wear cleanroom suits to protect the devices from human contamination.

* List of semiconductor fabrication plants

This is expected to become more commonplace as semiconductor fabrication moves from the current generation of 65 nm processes to the next 45 nm generations ( while experiencing new challenges such as increased variation across process corners ).

Some industries, such as semiconductor and steel manufacturers use the term fabrication instead.

* As an example of the impact of deep-ultraviolet excimer laser photolithography, in continuing the advances in semiconductor chip fabrication, IBM researchers announced in early 2006 that they had developed a technique to print circuitry only 29. 9 nm wide using 193 nm ArF excimer laser lithography.

The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to precisely control the location and concentration of p-and n-type dopants.

** Wire bonding, a method of making interconnections between a microchip and the outside world as part of semiconductor device fabrication

Simplified process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication.

The science encompasses concepts such as heterogeneous catalysis, semiconductor device fabrication, fuel cells, self-assembled monolayers, and adhesives.

It was the only commercial process technology for the fabrication of MOS integrated circuits with self-aligned gate that was later universally adopted by the semiconductor industry.

The output is a file which can be used to create a set of photomasks enabling a semiconductor fabrication facility ( commonly called a ' fab ') to produce physical ICs.

Germanium " metal " ( isolated germanium ) is used as semiconductor in transistors and various other electronic devices.

Once the various semiconductor devices have been created, they must be interconnected to form the desired electrical circuits.

Diatom cells repeatedly and reliably manufacture valves of various shapes and sizes, potentially allowing diatoms to manufacture micro-or nano-scale structures which may be of use in a range of devices, including: optical systems ; semiconductor nanolithography ; and even using diatom valves as vehicles for drug delivery.

For power rectification from very low to very high current, semiconductor diodes of various types ( junction diodes, Schottky diodes, etc.

High power rectifiers, such as are used in high-voltage direct current power transmission, employ silicon semiconductor devices of various types.

While third-party design tools were available, there was not an effective link from the third-party design tools to the layout and actual semiconductor process performance characteristics of the various ASIC manufacturers.

As they became available with adequate power ratings, transistors and various other types of semiconductor switches have been incorporated into inverter circuit designs.

He was the first to use a semiconductor junction to detect radio waves, and he invented various now commonplace microwave components.

In recent years there has also been massive growth in interest in the development of other forms of thin-film emitter, both those based on other carbon forms ( such as " carbon nanowalls ") and on various forms of wide-band-gap semiconductor.

It heated various samples of electronic and semiconductor material through the float-zone technique.

He has done research in various techniques and types of semiconductor crystal growth, electric and optical properties of materials, electronic devices for remote sensing and flat panel displays, and heat shield protection for atmospheric reentry of space vehicles.

Teledyne DALSA designs and manufactures a variety of digital imaging products for various industrial, scientific, and medical applications, including semiconductor wafer inspection, printed circuit inspection, general machine vision, digital radiography, medium format photography, aerial photogrammetry, and astronomy.

They eventually spent hundreds of millions trying to keep the company going during the various semiconductor and videogame crashes of the early 1980s, and eventually gave up and sold it to Thomson Semiconductor in 1985 for a mere $ 71 million.

ARM licenses the processor to various semiconductor companies, which design full chips based on the ARM processor architecture.

Ever since, ferromagnetic signals have been measured from various semiconductor hosts doped with different transition atoms.

D ' Angelo was previously in charge of various roles in the semiconductor industry, became European Director of Samsung Semiconductor in 1986.

These companies are involved in various sectors such as power, telecommunications, banking, automotive, airport management, infrastructure, property development, broadcasting, semiconductor, investment holding, research technology and venture capital.