These ions, under the influence of the electric field, are accelerated into the cathode surface containing the sample, bombarding the sample and causing neutral sample atom ejection through the process known as sputtering.

Techniques to do this include the process of sputtering, in which an ion beam liberates atoms from a target, allowing them to move through the intervening space and deposit on the desired substrate, and Evaporation ( deposition ), in which a material is evaporated from a target using either heat ( thermal evaporation ) or an electron beam ( e-beam evaporation ) in a vacuum system.

There is also a physical part, which is similar to the sputtering deposition process.

Using a process called sputtering, silver along with other optically transparent layers are applied to glass creating low emissivity coatings used in high performance insulated glazing or IGU.

The primary particles for the sputtering process can be supplied in a number of ways, for example by a plasma, an ion source, an accelerator or by a radioactive material emitting alpha particles.

The heat spike sputtering often increases nonlinearly with energy, and can for small cluster ions lead to dramatic sputtering yields per cluster of the order of 10000 .< ref name = Bouneau1982 > For animations of such a process see here.

Sputtering can also play a role in reactive ion etching ( RIE ), a plasma process carried out with chemically active ions and radicals, for which the sputtering yield may be enhanced significantly compared to pure physical sputtering.

* Sputtering Basics-animated film of a sputtering process

In disk manufacturing, a thin coating is deposited on both sides of the substrate, mostly by a vacuum deposition process called magnetron sputtering.

On top of it a protective carbon-based overcoat is deposited in the same sputtering process.

While only charged secondary ions emitted from the material surface through the sputtering process are used to analyze the chemical composition of the material, these represent a small fraction of the particles emitted from the sample.

Static SIMS is the process involved in surface atomic monolayer analysis, usually with a pulsed ion beam and a time of flight mass spectrometer, while dynamic SIMS is the process involved in bulk analysis, closely related to the sputtering process, using a DC primary ion beam and a magnetic sector or quadrupole mass spectrometer.

Some windows use laminate polyester film wherein at least one layer has been metalized using a process called sputtering.

This process is known as sputtering.

As mentioned earlier, gas ions and atoms striking the sample surface knock atoms off of it, a process known as sputtering.

The metal layer is deposited by magnetron sputtering and patterned by laser or lithography process.

If this happens, a process known as " sputtering ", high-mass particles from the container ( often steel and other metals ) are mixed into the fusion fuel, lowering its temperature.

This process was repeated on many campuses in the late 1980s, as a generation of people who grew up reading Mad magazine, National Lampoon and Spy magazine used computers to revive sputtering college humor magazines.

Physical sputtering is driven by momentum exchange between the ions and atoms in the materials, due to collisions.

A model for describing sputtering in the cascade regime for amorphous flat targets is Thompson's analytical model.

An algorithm that simulates sputtering based on a quantum mechanical treatment including electrons stripping at high energy is implemented in the program TRIM.

A different mechanism of physical sputtering is heat spike sputtering.

Heat spike sputtering is most important for heavy ions ( say Xe or Au or cluster ions ) with energies in the keV – MeV range bombarding dense but soft metals with a low melting point ( Ag, Au, Pb, etc .).

Physical sputtering has a well-defined minimum energy threshold which is equal to or larger than the ion energy at which the maximum energy transfer of the ion to a sample atom equals the binding energy of a surface atom.

Preferential sputtering can occur at the start when a multicomponent solid target is bombarded and there is no solid state diffusion.

Removing atoms by sputtering with an inert gas is called ` ion milling ' or ' ion etching '.

Sputtering which is observed to occur below the threshold energy of physical sputtering, is also often called chemical sputtering.

Sputter deposition is a method of depositing thin films by sputtering which involves eroding material from a " target " source onto a " substrate " e. g. a silicon wafer.

In semiconductor industry sputtering is used to etch the target.

Another application of sputtering is to etch away the target material.

In addition, sputtering is sometimes used with Auger spectroscopy to perform depth profiling experiments.

* Ion beam milling – thins samples until they are transparent to electrons by firing ions ( typically argon ) at the surface from an angle and sputtering material from the surface.

Amorphous metal wires have been produced by sputtering molten metal onto a spinning metal disk.

Metals can be deposited by electroplating, evaporation, and sputtering processes.

The term electronic sputtering can mean either sputtering induced by energetic electrons ( for example in a transmission electron microscope ), or sputtering due to very high-energy or highly charged heavy ions which lose energy to the solid mostly by electronic stopping power, where the electronic excitations cause sputtering.

At elevated temperatures, chemical sputtering of carbon can be understood to be due to the incoming ions weakening bonds in the sample, which then desorb by thermal activation.

The hydrogen-induced sputtering of carbon-based materials observed at low temperatures has been explained by H ions entering between C-C bonds and thus breaking them, a mechanism dubbed swift chemical sputtering.

However, while too low a current causes flickering, too high a current increases the wear of the electrodes by stimulating sputtering, which coats the internal surface of the lamp with metal and causes it to darken.

For instance, amorphous metal wires have been produced by sputtering molten metal onto a spinning metal disk ( melt spinning ).

Potential sputtering has only been observed for certain target species.

Electronic sputtering produces high sputtering yields from insulators, as the electronic excitations that cause sputtering are not immediately quenched, as they would be in a conductor.